Method of forming reduced short channel field effect transistor

ABSTRACT

A method for manufacturing a semiconductor device capable of reducing a short channel effect, whereby the semiconductor device includes a pair of impurity regions for a source and a drain formed on a semiconductor substrate, a gate having a gate electrode used to control a drain current, side walls formed on both sides of the gate electrode, and a pair of electrode members formed on both sides of the semiconductor substrate and in contact with the side walls. First impurity regions are formed by thermal diffusion of impurities from each of the electrode members, and second impurity regions each having thickness smaller than the first impurity region and extending below the gate electrode are formed by thermal diffusion of impurities from the side walls.

The present application is a divisional application under 35 U.S.C. §121of U.S patent application Ser. No. 09/895,301 filed on Jul. 2, 2001, nowU.S. Pat. No. 7,002.208. The disclosure of this application isspecifically incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method formanufacturing the same which are capable of reducing a short channeleffect which causes a decrease in a threshold voltage in thesemiconductor such as an FET (Field Effect Transistor).

2. Description of the Related Art

When a semiconductor device such as a MOS (Metal Oxide Semiconductor)transistor is scaled down, a so-called scaling law is used as an index.However, it is impossible to lower a supply voltage to meet the scalinglaw due to a need for considerations to be given to the supply of powerto other semiconductor devices, which, as a result, causes impactionization in which an electron and a hole are generated because ofcollision of a hot carrier having high energy caused by a high voltagewithin a channel region between a source and a drain with a lattice ofthe semiconductor device within a channel region. That is, this causes aso-called “hot carrier effect” in which a threshold voltage (Vth) ischanged due to a fixed charge accumulated in a gate insulator of theMOS.

To solve this problem, a device having an LDD (Lightly Doped Drain)structure to reduce the generation of hot carriers is proposed. In suchthe device having the LDD structure, a region providing a low impurityconcentration is formed which is placed in contact with each of a pairof impurity regions for a source and a drain and has the impurityconcentration being lower than that in each of the pair of impurityregions and extends in a channel extending direction from each of thecorresponding impurity regions. The region having the low impurityconcentration limits an electric field existing in the vicinity of thedrain and the generation of the hot carriers is reduced by the electricfield limiting effect.

A method for forming a semiconductor device having such the LDDstructure is disclosed in Japanese Patent Application Laid-open No. Hei5-315355 in which the pair of the impurity regions to be used for thesource and drain is formed by using a thermal diffusion method and eachof the impurity regions having the low impurity concentration andextending from each of the impurity regions for the and drain is formedby using ion implantation method. Moreover, a method is disclosed inJapanese Patent Application Laid-open No. Hei 5-153612 for forming boththe pair of the impurity regions to be used for the source and drain andthe low concentration impurity regions extending from each of theimpurity regions to be used for the source and the drain, by using theion concentration method.

In the conventional method, the extended impurity regions each extendingfrom each of the pair of the impurity regions to be used for the sourceand the drain toward the channel direction are formed by using the ionimplantaton method.

Therefore, in the conventional technology, since the impurity region isformed by the ion implantation method, its impurity distribution showsthat the impurity concentration is not lowered gradually from a surfaceof the device, but it becomes increased at a predetermined depth fromthe surface and exhibits its maximum level at the predetermined depthand then becomes decreased as the depth from the surface becomes larger.

The impurity distribution in the impurity region formed by the ionimplantation in which the maximum impurity concentration is exhibited atthe predetermined depth from the surface shows that the short channeleffect produced at a position being lower than the surface is reduced asa result. As described above, the short channel effect causes thedecrease in the threshold voltage and also causes a so-calledpunch-through phenomenon in which a voltage between the source and draincannot be controlled by the gate voltage.

SUMMARY OF THE INVENTION

In view of the above, it is an object of the present invention toprovide a semiconductor device and a method for manufacturing the samewhich are capable of reducing a short channel effect.

According to a first aspect of the present invention, there is provideda semiconductor device including:

a pair of impurity regions each being used for a source and for a drainand being formed at intervals on a semiconductor substrate;

a gate having a gate electrode formed on the semiconductor substrateused to control a drain current flowing between the impurity regions andside walls composed of insulating materials and formed on both sides ofthe gate electrode;

a pair of electrode members formed on both sides of the gate on thesemiconductor substrate and in a manner so as to be in contact with theside walls; and

wherein the pair of the impurity regions is made up of first impurityregions formed by thermal diffusion of an impurity from each of theelectrode members and of second impurity regions each having a thicknessbeing smaller than that of the first impurity region and extending belowthe gate electrode and which are formed by thermal diffusion of animpurity from the side walls.

In the foregoing, a preferable mode is one wherein the electrode memberis composed of silicide which has undergone implantation of an impurityby an ion implantation method prior to the thermal diffusion of theimpurity from the electrode member and wherein the side walls arecomposed of insulating materials which have undergone implantation of animpurity by the ion implantation method prior to the thermal diffusionof the impurity from the side walls.

Also, a preferable mode is one wherein an impurity concentration in thesecond impurity region is almost the same as that in the first impurityregion.

Also, a preferable mode is one wherein an impurity concentration in saidsecond impurity region is smaller than that in said first impurityregion.

Also, a preferable mode is one wherein each of the side walls extends,with its height being gradually decreased, on the semiconductorsubstrate in a direction in which both the side walls are brought nearto each other from side portions of both the electrodes facing eachother and wherein the gate electrode is formed in a manner that its bothsides are disposed on the side walls.

According to a second aspect of the present invention, there is provideda method for manufacturing a semiconductor device made up of a pair ofimpurity regions each being used for a source and for a drain and beingformed at intervals on a semiconductor substrate, a gate having a gateelectrode formed on the semiconductor substrate used to control a draincurrent flowing between the impurity regions and side walls composed ofinsulating materials and formed on both sides of the gate electrode anda pair of electrode members formed on both sides of the gate on thesemiconductor substrate and in a manner so as to be in contact with theside walls, including:

a step of forming a first impurity region below each of the electrodemember by thermal diffusion of an impurity from each of the electrodemembers on the semiconductor substrate; and

a step of forming a second impurity region having a thickness beingsmaller than that of the first impurity region and extending from thefirst impurity region below the gate electrode by thermal diffusion ofan impurity from the side walls on the semiconductor substrate and in amanner that the forming of the second impurity region proceeds incooperation with a reaction in the first impurity region.

In the foregoing, a preferable mode is one wherein the thermal diffusionemployed to form each of the first and second impurity regions issimultaneously executed by a RTA (Rapid Thermal Annealing) method.

Also, a preferable mode is one wherein the forming process of the firstimpurity regions includes a step of stacking a silicon layer to be usedfor the pair of the electrode members on the semiconductor substrate, astep of causing the silicon to become a silicide, a step of implantingthe impurity to be diffused into the silicide and a step of performingheating processing on the semiconductor substrate to thermally diffusethe impurity to the semiconductor substrate from the pair of theelectrode members obtained by performing patterning operations on thesilicon layer with the impurity implanted.

Also, a preferable mode is one wherein the forming process of the secondimpurity regions includes a step of stacking an insulating material tobe used for the pair of the side walls on the semiconductor substrate, astep of implanting the impurity to be diffused into a stacked layercomposed of the insulating material and a step of performing heatingprocessing on the semiconductor substrate to thermally diffuse theimpurity to the semiconductor substrate from the pair of the side wallsobtained by performing patterning operations on the stacked layer withthe impurity implanted.

Also, a preferable mode is one wherein the silicon layer to be used forthe electrode members is formed by a CVD (Chemical Vapor Deposition)method.

Also, a preferable mode is one wherein the process of causing thesilicon layer to become the silicide includes a step of stacking a metalmaterial on the silicon layer by a sputtering method and a step ofperforming thermal processing on the silicon layer to cause a metallayer composed of the metal material stacked on the silicon layer toreact with the silicon layer.

Furthermore, a preferable mode is one that wherein includes:

a step of stacking the silicon layer to be used for the pair of theelectrode members on the semiconductor substrate;

a step of causing the silicon to become a silicide;

a step of implanting the impurity to be diffused into the silicideobtained through the step of causing the silicon to become a silicide;

a step of performing etching processing on the silicide to form the pairof the electrode members by using the silicide into which the impurityis implanted;

a step of stacking insulating materials to be used for the pair of theside walls on the pair of the electrode members and on portions exposedbetween the electrode members on the semiconductor substrate;

a step of implanting the impurity to be diffused into the insulatinglayer formed by stacking of the insulating materials;

a step of removing unwanted portions of the insulating layer with theimpurity implanted to form the pair of the side walls facing each otherat intervals;

a step of forming a gate electrode formed between the side walls on thesemiconductor substrate with a gate insulator interposed between thegate electrode and the semiconductor substrate in a manner that bothsides of the gate electrode are disposed on both the side walls; and

a step of thermally diffusing the impurity simultaneously from each ofthe pair of the electrode members with the impurity implanted and fromeach of the pair of the side walls with the impurity implanted.

According to a third aspect of the present invention, there is provideda method for manufacturing a semiconductor device made up of a pair ofimpurity regions each being used for a source and for a drain and beingformed at intervals on a semiconductor substrate, a gate having a gateelectrode formed on the semiconductor substrate used to control a draincurrent flowing between the impurity regions and side walls composed ofinsulating materials and formed on both sides of the gate electrode anda pair of electrode members formed on both sides of the gate on thesemiconductor substrate and in a manner so as to be in contact with theside walls, including:

a step of forming a first impurity region below each of the electrodemember by thermal diffusion of an impurity from each of the electrodemembers on the semiconductor substrate; and

a step of forming a second impurity region having a thickness beingsmaller than that of the first impurity region and extending from thefirst impurity region below the gate electrode by thermal diffusion ofan impurity from the side walls on the semiconductor substrate and in amanner that the forming of the second impurity region proceeds incooperation with a reaction in the first impurity region, wherein thethermal diffusion employed to form each of the first and second impurityregions is simultaneously executed.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, advantages and features of the presentinvention will be more apparent from the following description taken inconjunction with the accompanying drawings in which:

FIGS. 1( a), (b) and (c) and

FIGS. 2( a), (b) and (c) are diagrams showing processes of manufacturinga semiconductor device 10 according to a first embodiment of the presentinvention; and

FIG. 3 is diagrams showing processes of manufacturing a semiconductordevice 10 according to a second embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Best modes of carrying out the present invention will be described infurther detail using various embodiments with reference to theaccompanying drawings.

First Embodiment

FIGS. 1( a), (b) and (c) and FIGS. 2( a), (b) and (c) are diagramsshowing processes of manufacturing a semiconductor device 10 accordingto a first embodiment of the present invention. In FIGS. 1( a), (b) and(c) and FIGS. 2( a), (b) and (c) is shown a process of manufacturing ann-channel MOS FET using, for example, a p-type substrate.

As shown in FIG. 1( a), on a silicon semiconductor substrate exhibitinga p-type characteristic, as is well known, is formed a device separatingregion 12 to partition an active region for a semiconductor device. Thedevice separating region 12 is formed by an STI (Shallow TrenchIsolation) method.

On the active region partitioned by the device separating region 12 isformed a gate electrode 14 used for the MOS FET. The gate electrode 14includes a gate electrode member 14 a formed on the active region with agate insulator 13 interposed therebetween. To form the gate electrode14, as is well known, on the active region are sequentially stacked aninsulating film (not shown) for the gate insulator 13 and a conductivepolycrystalline silicon layer (not shown) for the gate electrode member14 a. Patterning is performed by photolithographic etching technologyusing an etching mask composed of, for example, a silicon nitride filmformed on the conductive polycrystalline silicon layer. This causes thegate electrode material 14 a to be formed and the etching mask 15 toreside on the gate electrode member 14 a.

After the gate electrode member 14 a has been formed, a silicon dioxidelayer 16 to be used as side walls (described later) is formed, forexample, by a CVD (Chemical Vapor Deposition) method in a manner so asto cover the etching mask 15 on the gate electrode member 14 a and sideportions of the gate electrode member 14 a.

Then, in order to introduce the impurity into the silicon dioxide layer16, n-type impurity is implanted by the ion implantation. It ispreferable that the ion implantation is performed from a slantingdirection so that the impurity is efficiently implanted in portionspositioned on both sides of the gate electrode 14 a in the silicondioxide layer 16, that is, in the side walls 17.

As shown in FIG. 1( b), to remove unwanted portions except thosepositioned on both sides of the gate electrode member 14 a in thesilicon dioxide layer 16 containing the n-type impurity, for example,anisotropic etching processing is performed on the silicon dioxide layer16. After the side walls 17 between which the gate electrode member 14 ais interposed have been formed by using the anisotropic etchingprocessing, the etching mask 15 formed using the silicon nitride film isremoved by a selective etching method.

Then, as shown in FIG. 1( c), an upper electrode member 14 b is formedon the gate electrode member 14 a and a pair of the source/drainelectrode members 18 used for the source/drain is formed on the outsidesof both the side walls 17 on the source/drain electrode members 18 to beformed, a silicon and the pair of the source/drain electrode members 18to be formed, a silicon layer (not shown) with a thickness of 50 nm isstacked and then etching processing is selectively performed on thesilicon layer to remove unwanted portions, thus causing each of portionsof the upper electrode member 14 b and the pair of the source/drainelectrode members 18 to be formed.

Then, as shown in FIG. 2( a), a cobalt layer 19 is formed in a mannerthat it covers the device separating region 12, the side walls 17, theupper electrode member 14 b and the pair of the source/drain electrodemembers 18. The cobalt layer 19 is stacked so as to have a thickness of50 nm, for example, by using a sputtering method, as is well known.

After the cobalt layer 19 has been formed, heating processing isperformed on the upper electrode member 14 b and the pair of electrodemembers 18 so that they become a silicide containing the cobalt. Tocause them to become the silicide containing the cobalt, the cobaltlayer 19 is heated up to, for example, about 550° C., by a RTA methed,as pre-treatment. By this pre-treatment, the cobalt is diffused from thecobalt layer 19 to each of portions constituting the upper electrodemember 14 b and the pair of the source/drain electrode members 18contacting the cobalt layer 19 and silicon contained in the upperelectrode member 14 b and the pair of the source/drain electrode members18 changes to be cobalt monosilicide (CoSi). After the heatingprocessing as the pre-treatment has been performed, an-reacted portioncontained in the cobalt layer 19 is removed by chemicals and thenheating processing at a temperature of about 800° C. is performed by aRTA (Rapid Thermal Annealing) method. By the RTA method, each of thesilicon components constituting the upper electrode member 14 b and thepair of the source/drain electrode members 18 is further changed to becobalt disilicide (CoSi₂). By changing the silicon component to thesilicide, as is conventionally known, the upper electrode member 14 band the pair of the source/drain electrode members 18 each having a lowresistance are formed. The upper electrode member 14 b whose siliconcomponent have been changed to be the silicide and the gate electrodemember 14 a placed below the upper electrode member 14 b provide aconventionally well-known multi-layered gate electrode 14. The pair ofthe source/drain electrode members 18 whose silicon component has beenchanged to be the silicide is enabled to be in a good ohmic contact witha conductive line drawn from the source/drain electrode members 18.

Into the pair of the source/drain electrode members 18 is implanted ann-type impurity such as phosphorous to form impurity regions to be usedfor the source and the drain. On the other hand, as described byreferring to FIG. 1( a), into the side walls between which the gateelectrode 14 made up of the gate electrode member 14 a and the upperelectrode member 14 b is disposed is implanted the n-type impurity whilethe side walls are being formed. The impurity concentration set at thetime of the ion implantation into the pair of the source/drain electrodemembers 18 is higher than that set at the time of the ion implantationinto the side walls 17.

By performing heating processing, at a temperature of about 850° C. forten seconds, on the entire silicon semiconductor substrate 11, forexample, by the RTA method, after the ion implantation of the n-typeimpurity into the pair of the source/drain electrode members 18, theimpurity is diffused from the pair of the source/drain electrode members18 to the silicon semiconductor substrate 11 and the impurity isdiffused from both the side walls 17 to the silicon semiconductorsubstrate 11.

By the diffusion from the pair of the source/drain electrode members 18,a pair of first impurity regions 20 is formed in the siliconsemiconductor substrate 11 below the pair of the source/drain electrodemembers 18 used for the source and the drain.

Moreover, by the diffusion from both the side walls 17, a pair of secondimpurity regions 21 each extending from an edge portion being in contactwith each of the pair of the first impurity regions 20 toward regionsbelow the gate electrode 14 is formed in the silicon semiconductorsubstrate 11 below both the side walls 17. A depth of each of the secondimpurity regions 21, since the impurity concentration set at the time ofthe ion implantation into the side walls 17 is lower that that set atthe time of the ion implantation into the pair of the source/drainelectrode members 18, as described above, is smaller than that of eachof the first impurity regions 20.

Moreover, an impurity concentration in the second impurity regions 21 iscomparatively smaller than that in the first impurity regions 20. Thesemiconductor device having such the configurations as described aboveis called a device having the LDD structure in which the generation ofthe hot carriers can be effectively prevented by an field limitingeffect.

In the semiconductor device 10 of the first embodiment of the presentinvention, each of the second impurity regions 21 being an extendingimpurity region which extends in a direction in which both the secondimpurity regions 21 are brought near to each other from each of the pairof the first impurity regions 20 is formed by thermal diffusion of theimpurity from the side walls 17. The impurity concentration in theimpurity region formed by such the thermal diffusion as described aboveis highest in the vicinity of the surface of the silicon semiconductorsubstrate 11 and becomes lower as the depth from the surface becomeslarger.

In such the impurity concentration distribution, in the case of theconventional extending impurity region formed by the ion implantation,as described above, since the maximum impurity concentration isexhibited at the predetermined depth from the surface of the substrate,the short channel effect is accelerated.

Unlike in the case of the conventional semiconductor device, since thedistribution of the impurity concentration in the extending impurityregion 21 of the present invention shows that the impurity concentrationbecomes lower as the depth from the surface of the silicon semiconductorsubstrate 11 becomes larger, the short channel effect can be moreefficiently reduced compared with the case of the conventional impurityregions, thus preventing the decrease in the threshold voltage caused bythe short channel effect and avoiding the occurrence of thepunch-through phenomenon.

In the above description, the example in which the impurityconcentration of the extending impurity region 21 is lower than that inthe source/drain regions 20 is explained, however, the impurityconcentration in the extending impurity region 21 is made equal almostto that in the source/drain regions 20. For example, if a peak impurityconcentration in the souce/drain regions 20 provided in the impuritydistribution is 10²⁰ pieces/cm³, the peak impurity concentration in theextending impurity region 21 is 10¹⁹ pieces/cm³˜10²⁰ pieces/cm³.

Second Embodiment

In the process of manufacturing a semiconductor device 10 of a secondembodiment of the present invention, as shown in FIG. 3( a) to FIG. 3(d), after a pair of the source/drain electrode members 18 has beenformed, a gate electrode 14 is formed.

As shown in FIG. 3( a), on a silicon semiconductor substrate 11exhibiting a p-type characteristic is formed a device separating region12 having the same structure as in the first embodiment. A silicon layer22 with a thickness of 50 nm to be used as electrodes to be used for asource and a drain is formed on the active region partitioned by thedevice separating region 12. Then, a cobalt layer 19 is formed in amanner that it covers the device separating region 12 and the siliconlayer 22. The cobalt layer 19 is formed by the well-known sputteringmethod so as to have the thickness of 50 nm. Moreover, to introduce animpurity into the cobalt layer, the n-type impurity such as phosphorousis implanted by the ion implantation method.

Then, as shown in FIG. 3( b), to form electrode members to be used forthe source and drain, etching processing is performed on the siliconlayer 22 and the cobalt layer 19 existing on the silicon layer 22 toremove their unwanted portions. Heating processing is performed so as toreact the silicon residing by the etching processing with cobaltresiding on the silicon and to form a source/drain electrode members 18.The heating processing is performed by combining the same pre-treatmentheating as described above with heating treatment by the RTA method andbefore the RTA heating process is carried out, unwanted cobalt existingon the silicon portions is removed. The heating processing causes thesilicon layer 22 to react with the remaining portion of the cobalt layer19, thereby changing the remaining portion of the silicon layer 22 to bea silicide which acts as the source/drain electrode members 18.Moreover, the RTA heating processing causes a part of the impurityincorporated into the source/drain electrode members 18 out of theimpurity implanted into the cobalt layer 19 to be thermally diffused tothe silicon semiconductor substrate and the thermal diffusion causes apair of first impurity region 20 to be used for the source and drain tobe formed below the source and drain electrode members 18.

A silicon dioxide layer 16 to be used as side walls to insulate thesource/drain electrode members 18 and the gate electrode 14 to be formedlater is then formed by the CVD method in a manner that it covers thesource/drain electrode members 18 existing on the active region and theactive region on which no source/drain electrode electrodes 18 areformed. Moreover, in order to introduce the impurity into the silicondioxide layer 16, the n-type impurity such as phosphorous is implantedby the ion implantation. As in the case of the first embodiment, theimpurity concentration at the time of the ion implantation into thesilicon dioxide to be used as the side walls is set to be lower thanthat at the time of the ion implantation into the pair of thesource/drain electrode members 18. To efficiently implant the impurityinto the portion to be used as the side walls, it is preferable toperform the ion implantation from a slanting direction.

Then, as shown in FIG. 3( c), side walls 17 having shapes beingdifferent from the side walls in the first embodiment are formed in amanner that each of the side walls extends toward a direction in whichthe source/drain electrode members 18 are brought near to each otherfrom side portions of the source/drain electrode members 18 facing eachother and also in a manner that heights of the side walls graduallydecrease. These side walls can be formed by performing the anisotropicetching on the silicon dioxide layer 16 containing the n-type impurity.

As shown in FIG. 3( d), the gate electrode 14 for the MOS FET is formedon the active region disposed between both the side walls 17. Betweenthe gate electrode 14 and the active region is formed the gate insulator13, as is well known. That is, when the gate electrode 14 is formed, asis well known, an insulating layer (not shown) to be used for the gateinsulator 13 and, for example, a conductive polycrystalline siliconlayer (not shown) to be used for the gate electrode 14 are sequentiallystacked. Then, patterning operation is performed on the stacked layer bythe photolithographic etching technology using, for example, an etchingmask (not shown) on the conductive polycrystalline silicon layer. Thus,the gate electrode 14 is formed.

Then, by performing thermal treatment on the entire siliconsemiconductor substrate 11 using, for example, the RTA method, at atemperature of about 850° C. for 10 seconds, the impurity is diffusedfrom both the side walls 17 to the silicon semiconductor substrates 11and second impurity regions 21 is formed which extend from edge portionsof the first impurity regions coming near each other toward the gateelectrode 14. Moreover, by the RTA heating treatment at the hightemperature, the impurity is diffused from the pair of the source/drainelectrode members 18 to the silicon semiconductor substrate 11, whichcauses the impurity concentration in the pair of the first impurityregions 20 to reach a proper concentration.

A depth of each of the second impurity regions 21, since the impurityconcentration set at the time of the ion implantation into the sidewalls 17 is lower that set at the time of the ion implantation into thepair of the source/drain electrode members 18, as described above, issmaller than that of each of the first impurity regions 20.

Moreover, in the structure of the LDD having the second impurity region21 in which the impurity concentration is lower than that in the firstimpurity region 20, the generation of the hot carriers can beefficiently prevented by the electric field limiting effect.

In the semiconductor device 10 of the second embodiment, as in the caseof the first embodiment, the second impurity region 21 being theextending impurity region is formed by thermal diffusion of the impurityfrom the side walls 17.

Since the impurity concentration in the second impurity region 21 ishighest in the vicinity of the surface of the silicon semiconductorsubstrate 11 and becomes lower as the depth from the surface becomeslarger, the short channel effect occurring at a position being deeperthan the surface of the semiconductor substrate 11 can be efficientlyreduced and the decrease in the threshold voltage caused by the shortchannel effect and the generation of the punch-through phenomenon can beprevented.

As described above, according to the semiconductor device of the presentinvention, since the second impurity region extending from the firstimpurity region is formed by thermal diffusion from the side walls, theimpurity concentration in the second impurity region gradually lowers asthe depth from the surface of the semiconductor substrate becomesdeeper, which can reduce the short channel effect causing the decreasein the threshold of the gate voltage controlling carriers betweenchannels.

Moreover, according to the semiconductor device of the presentinvention, by adjusting the impurity concentration in the secondimpurity region, that is, by setting so that the impurity concentrationin the second impurity region is almost equal to that in the firstimpurity region, the short channel effect can be effectively reducedand, at the same time, sufficient drain currents can be obtained.

Furthermore, according to the method of manufacturing the semiconductordevice of the present invention, such the semiconductor devices asdescribed above can be manufactured comparatively easily.

It is thus apparent that the present invention is not limited to theabove embodiments but may be changed and modified without departing fromthe scope and spirit of the invention. For example, in the abovedescription, the present invention is applied to the n-type MOStransistor, however, the present invention can be applied to a p-typeMOS transistor and a gate device of transistors other than the MOStransistor.

1. A method for manufacturing a semiconductor device, comprising:forming a silicon layer on a semiconductor substrate; forming a metalliclayer on the silicon layer; implanting an impurity into the metalliclayer; etching the silicon layer and the implanted metallic layer toprovide a pair of spaced apart electrode members; performing a firstheat treatment to change the silicon layer to a metallic silicide layer;forming an insulating layer on the electrode members and on portions ofthe semiconductor substrate exposed between the electrode members;implanting the impurity into the insulating layer; removing unwantedportions of the implanted insulating layer to form side walls on theelectrode members that face each other with intervals therebetween;forming a gate electrode on the semiconductor substrate between the sidewalls; and thermally diffusing the impurity simultaneously from each ofthe electrode members and from the side walls to respectively form firstimpurity regions under the electrode members and second impurity regionsunder the side walls, wherein said forming a gate electrode is performedafter formation of the electrode members and the side walls.
 2. Themethod for manufacturing a semiconductor device of claim 1, whereinthickness of the second impurity regions is smaller than thickness ofthe first impurity regions.